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RF Vacuum Plasma Cleaning System – Precision Surface Treatment for High-Tech Industries

Overview

Le Radio Frequency (RF) Vacuum Plasma Cleaning System is a state-of-the-art surface treatment solution designed for ultra-clean processing of sensitive materials in controlled vacuum environments. Utilizing 13.56 MHz RF power, this system generates high-energy plasma to remove organic contaminants, oxides, and particulates from surfaces without causing thermal damage or mechanical wear.

Ideal for applications in semiconductors, microelectronics, medical devices, optoelectronics, and advanced materials research, our RF plasma cleaner delivers consistent, repeatable results with minimal environmental impact—making it the preferred choice for high-precision manufacturing and R&D labs.

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How It Works: Principle of RF Plasma Generation

Plasma is the fourth state of matter, formed when gas molecules are ionized by high-energy electrons. In the RF vacuum plasma cleaning process:

• The chamber is evacuated to a low-pressure environment (typically 10–100 mTorr).
• A 13.56 MHz RF generator applies alternating voltage across electrodes or an antenna.
• This creates an oscillating electric field that accelerates electrons, causing them to collide with gas molecules (e.g., O₂, Ar, N₂).
• These collisions generate reactive species such as ions, free radicals, UV photons, and excited atoms.
• These reactive particles bombard the sample surface, breaking down hydrocarbons, oils, dust, and native oxides into volatile byproducts that are pumped away.

This non-thermal, dry cleaning method ensures no residue remains on the surface, while maintaining material integrity.

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Key Applications

Our RF Vacuum Plasma Cleaning System is widely used in industries where surface purity is critical:

Industry	Application
Semiconductors	Wafer cleaning before lithography, dielectric layer preparation, pre-metal deposition
PCB & Electronics	Solder mask residue removal, flux cleaning, gold plating pre-treatment, COG/COF bonding prep
Medical Devices	Sterilization of implants, catheters, and surgical tools; surface activation for biocompatibility
Optoelectronics	LCD/OLED panel cleaning, touch screen (TP) pre-bonding, LED chip surface treatment
Advanced Materials	Functionalization of polymers, ceramics, metals, and composites for improved adhesion
Research & Development	Surface analysis, nanomaterial synthesis, thin-film deposition support

✅ Note: The system is also suitable for in-situ cleaning in vacuum coating lines (e.g., PVD, ALD).

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Avantages techniques

• ✅ High-Clean Performance: Removes sub-micron contaminants and native oxides effectively
• ✅ Precise Process Control: Adjustable power, pressure, time, and gas flow for optimal results
• ✅ Non-Destructive Treatment: No mechanical abrasion or chemical residue
• ✅ Vacuum Compatibility: Integrates seamlessly with other vacuum processes (e.g., evaporation, sputtering)
• ✅ Automated Operation: Supports intelligent modes with programmable sequences
• ✅ Low Environmental Impact: No hazardous waste; reusable process gases

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Product Specifications

Parameter	Specification
Power Supply	13.56 MHz RF Generator
Plasma Power	100W – 2000W (adjustable)
Operating Pressure	10 mTorr – 100 mTorr (adjustable)
Matériau de la chambre	Stainless Steel (304/316L), corrosion-resistant
Gas Input	O₂, Ar, N₂, H₂, CF₄, SF₆ (optional mixtures)
Vacuum Pump	Rotary vane pump or turbo molecular pump (optional)
Control Interface	Touchscreen HMI with PLC logic
Operation Modes	Manual / Automatic / Smart Auto Mode
Timer Function	Programmable cleaning duration (1–9999 seconds)
Gas Flow Control	Mass flow controllers (MFCs) for precise regulation
Pressure Control	Optional auto-pressure stabilization
Dimensions (L×W×H)	~800 × 600 × 1000 mm (standard model)
Weight	~150 kg
Certifications	CE, RoHS, ISO 9001

📌 Custom configurations available for batch processing, inline integration, or R&D labs.

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Intelligent Features

• Smart Auto Mode:
  Allows setting up two-stage cleaning cycles with different gases and durations per stage. Ideal for complex contamination profiles.
• Programmable Gas Flow:
  Enables precise control over gas ratios (e.g., O₂ + Ar mixture) to optimize oxidation or etching effects.
• Auto-Shutdown Timer:
  Ensures safe operation by automatically stopping the system when the preset cleaning time is reached.
• Vacuum Stability (Optional):
  Maintains constant internal pressure during process, ensuring consistent plasma density.

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Why Choose Our RF Vacuum Plasma Cleaning System?

• ✔️ Industry-Proven Technology: Deployed in leading semiconductor fabs, medical device manufacturers, and R&D institutes.
• ✔️ High Reliability: Robust stainless steel chamber ensures long-term durability.
• ✔️ Scalable Design: From lab-scale units to full production lines.
• ✔️ Energy Efficient: Optimized RF coupling minimizes power loss.
• ✔️ Compliant with Cleanroom Standards: Suitable for Class 100–1000 cleanrooms.

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Conclusion

Le RF Vacuum Plasma Cleaning System represents a gold standard in precision surface engineering. With its combination of high-efficiency cleaning, excellent process repeatability, and compatibility with advanced manufacturing workflows, it is an essential tool for industries demanding ultra-clean, high-integrity surfaces.

Whether you’re preparing substrates for bonding, coating, or packaging, our system ensures surface quality without compromise—delivering superior performance in every cycle.

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📞 Contact Us Today for a demo, technical consultation, or custom configuration design.

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