Medium Frequency Vacuum Plasma System

Medium Frequency Vacuum Plasma System – Precision Surface Cleaning for Advanced Manufacturing

Overview

The Medium Frequency (MF) Vacuum Plasma System is a high-performance, industrial-grade surface treatment solution designed for precision cleaning, activation, and functionalization of sensitive materials under controlled vacuum conditions. Utilizing 13.56 MHz RF power supply, this system generates stable plasma at low pressure (typically 10–100 mTorr), enabling deep penetration into microstructures and effective removal of organic contaminants without damaging substrates.

Ideal for semiconductor fabrication, PCB manufacturing, medical device sterilization, optoelectronics, and advanced materials research, our MF vacuum plasma system delivers consistent, repeatable results with minimal thermal impact—making it the preferred choice for high-reliability applications.

How It Works: Principle of RF Plasma Generation

At the heart of the system is a 13.56 MHz radio frequency (RF) generator, which provides the energy to ionize gases such as oxygen (O₂), argon (Ar), or nitrogen (N₂) inside a sealed vacuum chamber.

The chamber is evacuated to a low-pressure environment (~10–100 mTorr).
RF power is coupled through an electrode or antenna, creating an oscillating electric field.
This field accelerates electrons, causing them to collide with gas molecules and generate plasma—a highly reactive state containing ions, free radicals, UV photons, and excited species.
These reactive species bombard the material surface, breaking down hydrocarbons, oxides, and residues, while simultaneously enhancing surface energy and wettability.

Unlike atmospheric plasma systems, vacuum plasma enables deeper cleaning due to longer mean free path of particles and reduced interference from ambient air.

Key Applications

Our Medium Frequency Vacuum Plasma System is widely used in industries where ultra-clean surfaces are critical:

Industry	Application
Semiconductors	Wafer cleaning before photolithography, dielectric layer preparation, pre-metal deposition
PCB & Electronics	Solder mask residue removal, flux cleaning, gold plating pre-treatment, COG/COF bonding prep
Medical Devices	Sterilization of implants, catheters, and surgical tools; surface activation for biocompatibility
Optoelectronics	LCD/OLED panel cleaning, touch screen (TP) pre-bonding, LED chip surface treatment
Advanced Materials	Functionalization of polymers, ceramics, metals, and composites for improved adhesion
Research & Development	Surface analysis, nanomaterial synthesis, thin-film deposition support

✅ Note: The system is also suitable for in-situ cleaning in vacuum coating lines (e.g., PVD, ALD).

Technical Advantages

✅ High-Clean Performance: Removes sub-micron contaminants and native oxides effectively
✅ Precise Process Control: Adjustable power, pressure, time, and gas flow for optimal results
✅ Non-Destructive Treatment: No mechanical abrasion or chemical residue
✅ Vacuum Compatibility: Integrates seamlessly with other vacuum processes (e.g., evaporation, sputtering)
✅ Automated Operation: Supports intelligent modes with programmable sequences
✅ Low Environmental Impact: No hazardous waste; reusable process gases

Product Specifications

Parameter	Specification
Power Supply	13.56 MHz RF Generator
Plasma Power	100W – 2000W (adjustable)
Operating Pressure	10 mTorr – 100 mTorr (adjustable)
Materiale della camera	Stainless Steel (304/316L), corrosion-resistant
Gas Input	O₂, Ar, N₂, H₂, CF₄, SF₆ (optional mixtures)
Vacuum Pump	Rotary vane pump or turbo molecular pump (optional)
Control Interface	Touchscreen HMI with PLC logic
Operation Modes	Manual / Automatic / Smart Auto Mode
Timer Function	Programmable cleaning duration (1–9999 seconds)
Gas Flow Control	Mass flow controllers (MFCs) for precise regulation
Pressure Control	Optional auto-pressure stabilization
Dimensions (L×W×H)	~800 × 600 × 1000 mm (standard model)
Weight	~150 kg
Certifications	CE, RoHS, ISO 9001

📌 Custom configurations available for batch processing, inline integration, or R&D labs.

Intelligent Features

Smart Auto Mode:
Allows setting up two-stage cleaning cycles with different gases and durations per stage. Ideal for complex contamination profiles.
Programmable Gas Flow:
Enables precise control over gas ratios (e.g., O₂ + Ar mixture) to optimize oxidation or etching effects.
Auto-Shutdown Timer:
Ensures safe operation by automatically stopping the system when the preset cleaning time is reached.
Vacuum Stability (Optional):
Maintains constant internal pressure during process, ensuring consistent plasma density.

Why Choose Our Medium Frequency Vacuum Plasma System?

✔️ Industry-Proven Technology: Deployed in leading semiconductor fabs, medical device manufacturers, and R&D institutes.
✔️ High Reliability: Robust stainless steel chamber ensures long-term durability.
✔️ Scalable Design: From lab-scale units to full production lines.
✔️ Energy Efficient: Optimized RF coupling minimizes power loss.
✔️ Compliant with Cleanroom Standards: Suitable for Class 100–1000 cleanrooms.

Conclusion

The Medium Frequency Vacuum Plasma System represents a gold standard in precision surface engineering. With its combination of high-efficiency cleaning, excellent process repeatability, and compatibility with advanced manufacturing workflows, it is an essential tool for industries demanding ultra-clean, high-integrity surfaces.

Whether you’re preparing substrates for bonding, coating, or packaging, our system ensures surface quality without compromise—delivering superior performance in every cycle.

📞 Contact Us Today for a demo, technical consultation, or custom configuration design.